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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP23018-E/MJ
0.044100
0.109890
24
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP23018T-E/MJ
0.044100
0.212121
24
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP23018-E/SS
0.186500
0.389831
24
SSOP
.209in
Matte Tin
e3
download
MCP23018T-E/SS
0.186500
0.436191
24
SSOP
.209in
Matte Tin
e3
download
MCP23018-E/SSVAO
0.186500
0.389831
24
SSOP
.209in
Matte Tin
e3
download
MCP23018T-E/SSVAO
0.186500
0.436191
24
SSOP
.209in
Matte Tin
e3
download
MCP23018-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
MCP23018T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
MCP23018-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download