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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP23009-E/MG
0.021600
0.041667
16
QFN
3x3x0.9mm
Matte Tin
e3
download
MCP23009T-E/MG
0.021600
0.234849
16
QFN
3x3x0.9mm
Matte Tin
e3
download
MCP23009-E/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
MCP23009T-E/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
MCP23009-E/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
MCP23009T-E/SO
0.481000
1.000909
18
SOIC
.300in
Matte Tin
e3
download
MCP23009-E/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download