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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP23008-E/ML
0.043100
0.076923
20
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP23008T-E/ML
0.043100
0.212121
20
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP23008-E/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
MCP23008T-E/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
MCP23008T-E/SSVAO
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
MCP23008-E/SSVAO
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
MCP23008-E/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
MCP23008T-E/SO
0.481000
1.000909
18
SOIC
.300in
Matte Tin
e3
download
MCP23008-E/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download