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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP2050-330E/MQ
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
download
MCP2050-330E/MQVAO
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
download
MCP2050-500E/MQ
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
download
MCP2050T-330E/MQ
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3
download
MCP2050T-330E/MQVAO
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3
download
MCP2050T-500E/MQ
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3
download
MCP2050-330E/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2050T-330E/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2050-500E/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2050T-500E/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2050-330E/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download
MCP2050-500E/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download