Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP2003A-E/MD
0.043200
0.076923
8
DFN
4x4x0.9mm
Matte Tin
e3
download
MCP2003AT-E/MD
0.043200
0.212121
8
DFN
4x4x0.9mm
Matte Tin
e3
download
MCP2003A-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2003A-E/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2003AT-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2003AT-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2003A-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download