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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP1755S-3002E/MC
0.015600
0.033333
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1755S-3302E/MC
0.015600
0.033333
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1755ST-3002E/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1755ST-3302E/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1755S-1802E/MC
0.015600
0.033333
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1755S-5002E/MC
0.015600
0.033333
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1755ST-1802E/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1755ST-5002E/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1755S-3002E/DB
0.115700
0.217949
3
SOT-223
 
Matte Tin
e3
download
MCP1755S-3302E/DB
0.115700
0.217949
3
SOT-223
 
Matte Tin
e3
download
MCP1755S-5002E/DB
0.115700
0.217949
3
SOT-223
 
Matte Tin
e3
download
MCP1755ST-1802E/DB
0.115700
0.219250
3
SOT-223
 
Matte Tin
e3
download
MCP1755ST-3002E/DB
0.115700
0.219250
3
SOT-223
 
Matte Tin
e3
download
MCP1755ST-3302E/DB
0.115700
0.219250
3
SOT-223
 
Matte Tin
e3
download
MCP1755ST-5002E/DB
0.115700
0.219250
3
SOT-223
 
Matte Tin
e3
download