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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP1631-E/ML
0.043100
0.076923
20
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP1631T-E/ML
0.043100
0.212121
20
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP1631T-E/MLVAO
0.043100
0.212121
20
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP1631-E/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
MCP1631T-E/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
MCP1631-E/ST
0.078000
0.175676
20
TSSOP
4.4mm
Matte Tin
e3
download
MCP1631T-E/ST
0.078000
0.200000
20
TSSOP
4.4mm
Matte Tin
e3
download
MCP1631T-E/STVAO
0.078000
0.200000
20
TSSOP
4.4mm
Matte Tin
e3
download