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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP1624-I/MC
0.015600
0.033333
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1624T-I/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
MCP1624T-I/CHY
0.016450
0.046667
6
SOT-23
-
NiPdAu
e4
download
MCP1624T-I/CH
0.017000
0.046667
6
SOT-23
-
Matte Tin
e3
download