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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP14A0154-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP14A0154T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP14A0155-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP14A0155T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP14A0153T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP14A0153-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP14A0151T-E/MAY
0.014800
0.258333
6
DFN
2x2x0.9mm
NiPdAu
e4
download
MCP14A0152T-E/MAY
0.014800
0.258333
6
DFN
2x2x0.9mm
NiPdAu
e4
download
MCP14A0153T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP14A0154T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP14A0155T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP14A0153-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP14A0153T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP14A0154-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP14A0154T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP14A0155-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP14A0155T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP14A0151T-E/CH
0.017000
0.046667
6
SOT-23
-
Matte Tin
e3
download
MCP14A0152T-E/CH
0.017000
0.046667
6
SOT-23
-
Matte Tin
e3
download