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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP1404-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP1404-E/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP1404T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP1404T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP1404-E/SO
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
MCP1404T-E/SO
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
MCP1404-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MCP1404-E/MF
0.076900
0.133333
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
MCP1404T-E/MF
0.076900
0.218182
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download