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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
LP2951-02YN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
LP2951-03YN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
LP2951-02YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
LP2951-03YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
LP2951-02YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
LP2951-03YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download