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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
IS2064GM-0L3
0.164500
0.301333
68
VFLGA
8x8x1.0mm
SAC305
e1
download
IS2064GM-0L3-TRAY
0.164500
0.715385
68
VFLGA
8x8x1.0mm
SAC305
e1
download
IS2064GM-012
0.164500
0.301333
68
VFLGA
8x8x1.0mm
SAC305
e1
download
IS2064GM-012-TRAY
0.164500
0.715385
68
VFLGA
8x8x1.0mm
SAC305
e1
download
IS2064S-114SM-TRAY
 
0.865385
68
VQFN
8x8x0.9mm
Matte Tin
e3
 
IS2064S-114SM
 
0.334000
68
VQFN
8x8x0.9mm
Matte Tin
e3
 
IS2064B-114SM-TRAY
 
0.438776
61
VFBGA
5x5x0.9mm
SAC305
e1
 
IS2064B-114SM
 
0.207000
61
VFBGA
5x5x0.9mm
SAC305
e1