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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
HV5812PJ-G
1.142500
1.684211
28
PLCC
11.5x11.5x4.4mm
Matte Tin
e3
download
HV5812PJ-G-M904
1.142500
1.733333
28
PLCC
11.5x11.5x4.4mm
Matte Tin
e3
download
HV5812WG-G
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
HV5812P-G
4.066700
7.692308
28
PDIP
.600in
Matte Tin
e3
download