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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
HV2662LB-G
0.121650
0.769231
64
VFLGA
7x7x0.95mm
SAC
e1
 
HV2662GA-G
0.000000
0.382212
64
VFBGA
7x7x1.0mm
SAC125+Ni
e8