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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
COM20019I3V-HT
0.176300
0.760000
48
TQFP
7x7x1.4mm
Matte Tin
e3
download
COM20019I-DZD
1.142500
0.435897
28
PLCC
11.5x11.5x4.4mm
Matte Tin
e3
download
COM20019I-DZD-TR
1.142500
1.733333
28
PLCC
11.5x11.5x4.4mm
Matte Tin
e3
download