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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
CAP1296-1-AIA
0.027700
0.000000
10
VDFN
3x3x0.9
NiPdAu
e4
download
CAP1296-1-AIA-TR
0.027700
0.114000
10
VDFN
3x3x0.9
NiPdAu
e4
download
CAP1296-2-AIA-TR
0.027700
0.114000
10
VDFN
3x3x0.9
NiPdAu
e4
download
CAP1296-1-SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
CAP1296-1-SL-TR
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
CAP1296-2-SL-TR
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download