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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
CAP1293-1-AC3
0.048500
0.000000
8
TDFN
2x3x0.75
NiPdAu
e4
download
CAP1293-1-AC3-TR
0.048500
0.139394
8
TDFN
2x3x0.75
NiPdAu
e4
download
CAP1293-2-AC3-TR
0.048500
0.139394
8
TDFN
2x3x0.75
NiPdAu
e4
download
CAP1293-1-SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
CAP1293-1-SN-TR
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
CAP1293-2-SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
CAP1293-2-SN-TR
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download