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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
BM64SPKA1MC1-0001AA
 
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
 
BM64SPKA1MC2-0001AA
 
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
 
BM64SPKS1MC1-0001AA
 
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
 
BM64SPKS1MC2-0001AA
 
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
 
BM64SPKS1MC1-00M2AA
 
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4