Microchip Technology Inc

RoHS Device Search


Part
Number
Device
Weight
Shipping
Weight
Lead
Count
Package
Type
Package
Width
Solder
Composition
JEDEC
Indicator
RoHS
 
China
EFUP
Package Specification
ATXMEGA32A4-AUR
0.273300
0.599000
44
TQFP
10x10x1mm
Matte Tin
e3
ATXMEGA32A4U-AN
0.273300
1.187500
44
TQFP
10x10x1mm
Matte Tin
e3
ATXMEGA32A4-AU
0.273300
1.187500
44
TQFP
10x10x1mm
Matte Tin
e3
ATXMEGA32A4U-ANR
0.273300
0.599000
44
TQFP
10x10x1mm
Matte Tin
e3
ATXMEGA32A4U-AUR
0.273300
0.599000
44
TQFP
10x10x1mm
Matte Tin
e3
ATXMEGA32A4U-AU
0.273300
1.187500
44
TQFP
10x10x1mm
Matte Tin
e3
ATXMEGA32A4-CCUR
0.024000
0.024000
49
UFBGA
5x5x0.6mm
LF35
e8
ATXMEGA32A4-CCU
0.024000
0.024490
49
UFBGA
5x5x0.6mm
LF35
e8
ATXMEGA32A4-CUR
0.044300
0.007333
49
VFBGA
5x5x1mm
SAC105
e8
ATXMEGA32A4-CU
0.044300
0.044898
49
VFBGA
5x5x1mm
SAC105
e8
ATXMEGA32A4U-CUR
0.044300
0.007333
49
VFBGA
5x5x1mm
SAC105
e8
ATXMEGA32A4U-CU
0.044300
0.044898
49
VFBGA
5x5x1mm
SAC105
e8
ATXMEGA32A4U-CUA0
0.044300
0.044898
49
VFBGA
5x5x1mm
SAC105
e8
ATXMEGA32A4U-MH
0.135200
0.136111
44
VQFN
7x7x1mm
NiPdAu
e4
ATXMEGA32A4-MHR
0.135200
0.061000
44
VQFN
7x7x1mm
NiPdAu
e4
ATXMEGA32A4-MH
0.135200
0.136111
44
VQFN
7x7x1mm
NiPdAu
e4
ATXMEGA32A4U-MHR
0.135200
0.061000
44
VQFN
7x7x1mm
NiPdAu
e4

Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.
MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions
MSL LEVEL
TIME
CONDITIONS
MSL-1
Unlimited
≤ 30°C/85% RH
MSL-3
168 hours
≤ 30°C/60% RH
PLEASE NOTE:

Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or implied) is given and all liability is disclaimed by Microchip Technology Incorporated with respect to the accuracy or your use of such information.