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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATTINY261A-MFR
0.060800
0.061000
32
VQFN
5x5x1mm
Matte Tin
e3
download
ATTINY261A-MNR
0.060800
0.061000
32
VQFN
5x5x1mm
Matte Tin
e3
download
ATTINY261A-MU
0.060800
0.448980
32
VQFN
5x5x1mm
Matte Tin
e3
download
ATTINY261A-MN
0.060800
0.448980
32
VQFN
5x5x1mm
Matte Tin
e3
download
ATTINY261A-MUR
0.060800
0.061000
32
VQFN
5x5x1mm
Matte Tin
e3
download
ATTINY261A-MF
0.060800
0.448980
32
VQFN
5x5x1mm
Matte Tin
e3
download
ATTINY261A-XUR
0.078000
0.200000
20
TSSOP
4.4mm
Matte Tin
e3
download
ATTINY261A-XU
0.078000
0.175676
20
TSSOP
4.4mm
Matte Tin
e3
download
ATTINY261A-SU
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
ATTINY261A-SUR
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
download
ATTINY261A-PU
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download