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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATTINY20-CCU
0.007500
0.410204
15
UFBGA
3x3x0.6mm
LF35
e8
download
ATTINY20-CCUR
0.007500
0.007500
15
UFBGA
3x3x0.6mm
LF35
e8
download
ATTINY20-UUR
0.002000
0.135200
12
WLCSP
1.555x1.403x0.538mm
SAC405
e1
download
ATTINY20-MMH
0.018900
0.126531
20
VQFN
3x3x0.85mm
NiPdAu
e4
download
ATTINY20-MMHR
0.018900
0.105000
20
VQFN
3x3x0.85mm
NiPdAu
e4
download
ATTINY20-MMHRA0
0.018900
0.105000
20
VQFN
3x3x0.85mm
NiPdAu
e4
download
ATTINY20-XU
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
download
ATTINY20-XUR
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
download
ATTINY20-SSUR
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
ATTINY20-SSUR704
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
ATTINY20-SSUR892
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
ATTINY20-SSUR988
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
ATTINY20-SSURA01
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
ATTINY20-SSURA87
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
ATTINY20-SSURB47
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
ATTINY20-SSU
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download