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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATTINY806-MNR
0.019100
0.003333
20
VQFN
3x3x0.9mm
Matte Tin
e3
download
ATTINY806-MFR
0.019100
0.003333
20
VQFN
3x3x0.9mm
Matte Tin
e3
download
ATTINY806-MF
0.019100
0.420408
20
VQFN
3x3x0.9mm
Matte Tin
e3
download
ATTINY806-MN
0.019100
0.420408
20
VQFN
3x3x0.9mm
Matte Tin
e3
download
ATTINY806-MNRA1
0.019100
0.003333
20
VQFN
3x3x0.9mm
Matte Tin
e3
download
ATTINY806-SF
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
ATTINY806-SN
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
ATTINY806-SNR
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
download
ATTINY806-SFR
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
download