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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATTINY261-15MAZ
0.036400
0.006000
20
WQFN
4x4x0.8mm
Matte Tin
e3
download
ATTINY261-15MD
0.061300
0.148200
32
VQFN
5x5x0.9mm
Matte Tin
e3
download
ATTINY261-15MZ
0.061300
0.148200
32
VQFN
5x5x0.9mm
Matte Tin
e3
download
ATTINY261-15XD
0.078000
0.200000
20
TSSOP
4.4mm
Matte Tin
e3
download
ATTINY261-15XZ
0.078000
0.200000
20
TSSOP
4.4mm
Matte Tin
e3
download
ATTINY261-15SZ
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
download