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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMW25H18-MR210PB
 
2.857143
51
MODULE
xxmm
ENIG
b4
 
ATSAMW25H18-MR510UB
 
2.857143
51
MODULE
xxmm
ENIG
b4
 
ATSAMW25H18-MR510PB
 
2.857143
51
MODULE
xxmm
ENIG
b4
 
ATSAMW25H18-MR210PB1952
 
2.857143
51
MODULE
xxmm
ENIG
b4
 
ATSAMW25H18-MR210PB1944
 
2.857143
51
MODULE
xxmm
ENIG
b4
 
ATSAMW25H18-MR210PB1954
 
2.857143
51
MODULE
xxmm
ENIG
b4
 
ATSAMW25H18-MR210PB1961
 
2.857143
51
MODULE
xxmm
ENIG
b4