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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMR30M18AT-I/RM100
 
1.125000
25
MODULE
12.7x11mm
Au
b4
 
ATSAMR30M18A-I/RM100
 
1.625000
25
MODULE
12.7x11mm
Au
b4