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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMG55G19A-UUT
0.008200
0.271600
49
WLCSP
2.84x2.84x0.29mm
SAC405
e1
download
ATSAMG55G19B-UNT
0.008200
0.271600
49
WLCSP
2.84x2.84x0.29mm
SAC405
e1
download
ATSAMG55G19B-UUT
0.008200
0.271600
49
WLCSP
2.84x2.84x0.29mm
SAC405
e1
download
ATSAMG55J19A-MU
0.159900
0.988462
64
VQFN
7.5x7.5x0.9mm
Matte Tin
e3
download
ATSAMG55J19A-MUT
0.159900
0.502857
64
VQFN
7.5x7.5x0.9mm
Matte Tin
e3
download
ATSAMG55J19A-MUT-836
0.159900
0.502857
64
VQFN
7.5x7.5x0.9mm
Matte Tin
e3
download
ATSAMG55J19B-MU
0.159900
0.988462
64
VQFN
7.5x7.5x0.9mm
Matte Tin
e3
download
ATSAMG55J19B-MUT
0.159900
0.502857
64
VQFN
7.5x7.5x0.9mm
Matte Tin
e3
download
ATSAMG55J19A-AU
0.368300
1.087500
64
LQFP
10x10x1.4mm
Matte Tin
e3
download
ATSAMG55J19A-AUT
0.368300
0.366667
64
LQFP
10x10x1.4mm
Matte Tin
e3
download
ATSAMG55J19B-AU
0.368300
1.087500
64
LQFP
10x10x1.4mm
Matte Tin
e3
download
ATSAMG55J19B-AUT
0.368300
0.366667
64
LQFP
10x10x1.4mm
Matte Tin
e3
download