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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMA5D31A-CU
0.508300
1.515873
324
LFBGA
15x15x1.4mm
SAC105
e8
download
ATSAMA5D31A-CUR
0.508300
1.450000
324
LFBGA
15x15x1.4mm
SAC105
e8
download
ATSAMA5D31A-CFUR
0.259200
0.259000
324
TFBGA
12x12x1.2mm
LF35
e8
download
ATSAMA5D31A-CFU
0.259200
1.041667
324
TFBGA
12x12x1.2mm
LF35
e8
download