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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMA5D28B-CU
0.444500
1.714286
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28B-CUR
0.444500
0.445000
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28C-CN
0.444500
1.714286
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28C-CNR
0.444500
0.445000
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28C-CU
0.444500
1.714286
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28C-CUR
0.444500
0.445000
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28A-CU
0.444500
1.714286
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28B-CNR
0.444500
0.445000
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28B-CN
0.444500
1.714286
289
LFBGA
14x14x1.4mm
LF35
e8
download
ATSAMA5D28C-D1G-CU
0.445500
2.436975
289
TFBGA
14x14x1.2mm
LF35
e8
download
ATSAMA5D28C-D1G-CUR
0.445500
1.580000
289
TFBGA
14x14x1.2mm
LF35
e8
download
ATSAMA5D28C-LD1G-CUR
 
0.488000
361
TFBGA
16x16x1.2mm
SAC105
e8
 
ATSAMA5D28C-LD1G-CU
 
2.059524
361
TFBGA
16x16x1.2mm
SAC105
e8
 
ATSAMA5D28C-LD2G-CU
 
2.059524
361
TFBGA
16x16x1.2mm
SAC105
e8
 
ATSAMA5D28C-LD2G-CUR
 
0.488000
361
TFBGA
16x16x1.2mm
SAC105
e8