Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMA5D27C-LD2G-CUR
0.000000
0.488000
361
TFBGA
16x16x1.2mm
SAC105
e8
 
ATSAMA5D27C-LD2G-CU
0.000000
2.059524
361
TFBGA
16x16x1.2mm
SAC105
e8