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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMA5D27C-D1G-CUR
0.445500
1.580000
289
TFBGA
14x14x1.2mm
LF35
e8
download
ATSAMA5D27C-D1G-CU
0.445500
2.436975
289
TFBGA
14x14x1.2mm
LF35
e8
download