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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMA5D24A-CUR
0.106200
0.706000
256
TFBGA
8x8x1.05mm
LF35
e8
download
ATSAMA5D24A-CU
0.106200
0.961539
256
TFBGA
8x8x1.05mm
LF35
e8
download
ATSAMA5D24C-CU
0.106200
0.961539
256
TFBGA
8x8x1.05mm
LF35
e8
download
ATSAMA5D24B-CUR
0.106200
0.706000
256
TFBGA
8x8x1.05mm
LF35
e8
download
ATSAMA5D24C-CUR
0.106200
0.706000
256
TFBGA
8x8x1.05mm
LF35
e8
download
ATSAMA5D24B-CU
0.106200
0.961539
256
TFBGA
8x8x1.05mm
LF35
e8
download