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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAMA5D225C-D1M-CU
0.234200
1.289773
196
TFBGA
11x11x1.2mm
LF35
e8
download
ATSAMA5D225C-D1M-CUR
0.234200
0.234000
196
TFBGA
11x11x1.2mm
LF35
e8
download