Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAM4SD32CB-ANR
0.580400
1.600000
100
LQFP
14x14x1.4mm
Matte Tin
e3
download
ATSAM4SD32CB-AN
0.580400
6.666667
100
LQFP
14x14x1.4mm
Matte Tin
e3
download
ATSAM4SD32CA-CFU
0.074400
0.842308
100
VFBGA
7x7x1mm
SAC105
e8
download
ATSAM4SD32CA-CFUR
0.074400
0.262000
100
VFBGA
7x7x1mm
SAC105
e8
download
ATSAM4SD32CA-AU
0.580400
6.666667
100
LQFP
14x14x1.4mm
Matte Tin
e3
download
ATSAM4SD32CA-AUR
0.580400
1.600000
100
LQFP
14x14x1.4mm
Matte Tin
e3
download
ATSAM4SD32CA-CUR
0.139600
0.515000
100
TFBGA
9x9x1.2mm
SAC105
e8
download
ATSAM4SD32CB-CN
0.139600
0.696154
100
TFBGA
9x9x1.2mm
SAC105
e8
download
ATSAM4SD32CA-CU
0.139600
0.696154
100
TFBGA
9x9x1.2mm
SAC105
e8
download
ATSAM4SD32CB-CNR
0.139600
0.515000
100
TFBGA
9x9x1.2mm
SAC105
e8
download
ATSAM4SD32CB-CFNR
0.074400
0.262000
100
VFBGA
7x7x1mm
SAC105
e8
download
ATSAM4SD32CB-CFN
0.074400
0.842308
100
VFBGA
7x7x1mm
SAC105
e8
download