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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAM4E8EA-CU
0.215400
1.065217
144
LFBGA
10x10x1.4mm
SAC105
e8
download
ATSAM4E8EA-CUR
0.215400
0.217000
144
LFBGA
10x10x1.4mm
SAC105
e8
download
ATSAM4E8EB-CN
0.215400
1.065217
144
LFBGA
10x10x1.4mm
SAC105
e8
download
ATSAM4E8EB-CNR
0.215400
0.217000
144
LFBGA
10x10x1.4mm
SAC105
e8
download
ATSAM4E8EA-AN
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
ATSAM4E8EA-ANR
1.392800
2.285714
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
ATSAM4E8EA-AU
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
ATSAM4E8EA-AUR
1.392800
2.285714
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
ATSAM4E8EB-AN
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
ATSAM4E8EB-ANR
1.392800
2.285714
144
LQFP
20x20x1.4mm
Matte Tin
e3
download