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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATSAM3X8EA-CU
0.214700
1.130435
144
LFBGA
10x10x1.4mm
LF35
e8
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ATSAM3X8EA-AU
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
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