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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATECC608A-MAH22-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
ATECC608A-MAHA2-B
0.009600
0.000000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
ATECC608A-MAHCZ-S
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
ATECC608A-MAHDA-S
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
ATECC608A-MAHDA-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
ATECC608A-MAHTN-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
ATECC608A-MAHCZ-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
ATECC608A-SSHCZ-B
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
ATECC608A-SSHDA-B
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
ATECC608A-SSHDA-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
ATECC608A-SSHCZ-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download