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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
ATA6566-GBQW1
0.023100
0.099000
8
VDFN
3x3x1.0mm
Matte Tin
e3
download
ATA6566-GBQW0
0.023100
0.099000
8
VDFN
3x3x1.0mm
Matte Tin
e3
download
ATA6566-GAQW0
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
ATA6566-GAQW1
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download