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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT93C86AY6-10YH-1.8-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT93C86AY6-10YH-18-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT93C86AY6-10YH-1.8-T-923
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT93C86A-10TU-1.8-T
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
AT93C86A-10TU-2.7
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
AT93C86A-10TU-2.7-T
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
AT93C86A-10TU-1.8
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
AT93C86A-10SU-1.8-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C86A-10SU-2.7
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C86A-10SU-1.8
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C86A-10SU-2.7-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C86A-SQ27R4
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C86A-10PU-1.8
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
AT93C86A-10PU-2.7
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download