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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT93C66B-MAHM-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT93C66B-XHM-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT93C66B-XPD-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT93C66B-XHM-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT93C66B-MAHM-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT93C66B-SSHM-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C66B-SSHM-B
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download