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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT93C46D-W-11
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT93C46DU3-UU-T
0.004400
0.000000
8
VFBGA
1.5x2x0.85mm
SAC405
e1
download
AT93C46D-TH-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT93C46D-TH-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT93C46D-THAU-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT93C46D-THAU-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT93C46D-TH-T-834
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT93C46DY6-YH-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT93C46DY6-YH-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT93C46DN-SH-T-834
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT93C46DN-SH-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C46DN-SH-B
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C46DN-SH-T-537
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C46DN-SH-T-989
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT93C46D-PU
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
AT93C46D-PUAW
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download