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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT91SAM9G45C-CU-999
0.374300
0.378000
324
TFBGA
15x15x1.2mm
SAC105
e8
download
AT91SAM9G45B-CU
0.374300
1.571429
324
TFBGA
15x15x1.2mm
SAC105
e8
download
AT91SAM9G45C-CU
0.374300
1.571429
324
TFBGA
15x15x1.2mm
SAC105
e8
download