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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT91SAM9CN11-CUR
0.526700
1.452000
217
LFBGA
15x15x1.46mm
SAC105
e8
download
AT91SAM9CN11-CU
0.526700
1.507937
217
LFBGA
15x15x1.46mm
SAC105
e8
download