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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT89LP4052-20XU
0.078000
0.175676
20
TSSOP
4.4mm
Matte Tin
e3
download
AT89LP4052-20SU
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
AT89LP4052-20SUR
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
download
AT89LP4052-20PU
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download