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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT88SC12816C-WI
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT88SC12816C-SU
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT88SC12816C-SU-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT88SC12816C-MJTG
0.104400
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
download
AT88SC12816C-MJ
0.104400
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
download
AT88SC12816C-PU
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download