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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT88SC0808CA-WI
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT88SC0808CA-TH-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT88SC0808CA-TH
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT88SC0808CA-Y6H-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT88SC0808CA-SH587
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT88SC0808CA-SH-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT88SC0808CA-SH
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT88SC0808CA-MJTG
0.104400
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
download
AT88SC0808CA-MPTG
0.000000
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
 
AT88SC0808CA-MJ
0.104400
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
download
AT88SC0808CA-MP
0.000000
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
 
AT88SC0808CA-PU
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download