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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT88SC0404C-WI
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT88SC0404C-SH
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT88SC0404C-SH-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT88SC0404C-MJTG
0.104400
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
download
AT88SC0404C-MPTG
0.000000
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
 
AT88SC0404C-ME
0.000000
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
 
AT88SC0404C-MJ
0.104400
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
download
AT88SC0404C-MP
0.000000
2250.000
0
SCC
12.6x11.4x0.58mm
NiAu
e4
 
AT88SC0404C-PU
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download