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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT30TS75A-MA8M-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT30TS75A-XM8M-T
0.023200
0.710000
8
MSOP
3x3mm
NiPdAu
e4
download
AT30TS75A-XM8M-B
0.023200
0.530612
8
MSOP
3x3mm
NiPdAu
e4
download
AT30TS75A-SS8M-B
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT30TS75A-SS8M-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download