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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT28HC64BF-70JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
download
AT28HC64BF-12JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
download
AT28HC64BF-90JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
download
AT28HC64BF-12JU
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
download
AT28HC64BF-70TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
download
AT28HC64BF-12TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
download
AT28HC64BF-90TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
download
AT28HC64BF-12SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
AT28HC64BF-12SU
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
AT28HC64BF-70SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
AT28HC64BF-90SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download