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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT25M01-WWU11M
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT25M01-SHM-B
0.135700
2.700000
8
SOIJ
.208in
NiPdAu
e4
download
AT25M01-SHM-T
0.135700
0.390476
8
SOIJ
.208in
NiPdAu
e4
download
AT25M01-UUM-T
0.003800
0.000000
8
WLCSP
2.03x2.432x0.538mm
SAC405
e1
download
AT25M01-MFHM-T
0.049000
0.166667
8
UDFN
5x6x0.65mm
NiPdAu
e4
download
AT25M01-SSHM-B
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT25M01-SSHM-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download