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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT25160B-WWU27LER
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT25160B-WWU11L
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT25160B-WWU11LER
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT25160B-CUL-T
0.004400
0.000000
8
VFBGA
1.5x2x0.85mm
SAC405
e1
download
AT25160B-XHL-B-899
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT25160B-XHL-T-899
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT25160B-XHLHX-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT25160B-XPDGV-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT25160B-XHL-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT25160B-XHL-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT25160B-MAHL-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT25160B-MAPDGV-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT25160B-MAPDGV-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT25160B-MAHL-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT25160B-MAHL-T-899
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT25160B-SSHL-B-899
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT25160B-SSHL-T-899
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT25160B-SSHL-B
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT25160B-SSPDGV-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT25160B-SSHL-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT25160B-MEHL-T
0.003300
0.000000
8
XDFN
1.8x2.2x0.4mm
NiPdAu
e4
download